Amkor Announces FusionQuad(R) Technology Licensed to ASAT

Amkor Technology, Inc. (Nasdaq: AMKR) today announced ASAT Holdings Limited (Nasdaq: ASTT) has entered into an agreement to license Amkor’s FusionQuad^® package technology. This agreement will enable ASAT to manufacture packages based on Amkor’s FusionQuad^® technology platform.

"The market has been seeking a low cost package technology to better serve applications in the 150 to 350 pin count range. We believe FusionQuad^® technology meets these cost sensitive requirements and also provides improved thermal and electrical performance for advanced applications. We are in the process of deploying this technology to meet challenging ASIC requirements in hard disk drive, multi-functional printer and HDTV applications,” said Jim Fusaro, Amkor’s corporate VP responsible for wirebond products. "Amkor is pleased that ASAT also sees applications for this technology and we believe multiple sources of supply will facilitate broader adoption of this innovative new package platform,” added Fusaro.

"ASAT and Amkor have enjoyed benefits from our licensing agreements in recent years and we are pleased to extend that cooperation to include the FusionQuad^® technology. Growth in QFP packages has been slowing as the technology has matured, with little innovation over the past few years. We believe the FusionQuad^® technology will inject new growth in the QFP family and is an attractive extension to our current package offerings,” said Jeff Osmun, ASAT’s President.

About FusionQuad^®

The FusionQuad^® packaging technology is based on a novel leadframe plastic encapsulated package that provides superior electrical and thermal performance for cost sensitive applications. FusionQuad^® technology integrates bottom lands within a standard QFP package outline to enable doubling of the interconnect density, improved signal integrity for high speed signals and higher power dissipation.

About Amkor

Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on FusionQuad^® can be found on Amkor's web site: www.amkor.com.

About ASAT

ASAT Holdings Limited is a global provider of semiconductor package design, assembly and test services. With 20 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT’s advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the Company has operations in the United States, Asia and Europe. For more information, visit www.asat.com.

Forward Looking Statement Disclaimer

This press release contains forward-looking statements within the meaning of federal securities laws. All statements other than statements of historical fact are considered forward looking statements including, without limitation, statements regarding the ability of FusionQuad^® packages to meet the cost sensitive requirements and improve thermal and electrical performance for advanced applications, adoption of the FusionQuad^® technology, and the impact of FusionQuad^® technology on growth in the QFP family of packages. Important risk factors that could affect the outcome of the events set forth in these statements and that could affect our operating results and financial condition are discussed in the Company’s Annual Report on Form 10-K for the year ended December 31, 2007 and in the Company’s subsequent filings with the Securities and Exchange Commission made prior to or after the date hereof. Amkor undertakes no obligation to review or update any forward looking statements to reflect events or circumstances occurring after the date of this press release.

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