Amkor Technology, Inc. (Nasdaq: AMKR) today announced the introduction
of FusionQuad™, a novel package technology
designed for applications that demand superior electrical and thermal
performance in a budget-conscious environment. Amkor recently
co-presented FusionQuad™ with a leading
digital storage OEM at the Surface Mount Technology Association (SMTA)
Pan Pacific Microelectronics Symposium in Kauai, HI. The paper
highlighted FusionQuad’s size and performance
benefits reporting a dramatic improvement in electrical performance at
frequencies up to 10 GHz.
FusionQuad™ is a leadframe-based, plastic
encapsulated package which integrates bottom lands within a standard QFP
package outline. The novel combination of both peripheral leads and
bottom lands allows for an approximate doubling of I/O within a given
body size, or a nearly 50% reduction in body size for an existing lead
count. Initial FusionQuad™ package options
range from 100 to 376 I/O – in both single and
dual row bottom land configurations – in body
sizes ranging from 10 to 24mm. With a package thickness of just 0.8mm,
FusionQuad™ is attractive for a variety of
applications in practically all semiconductor markets.
"We are excited to bring to market a new
packaging concept that meets the need for high performance and low cost,”
said Jim Fusaro, corporate vice president responsible for wirebond
products at Amkor. Fusaro added, "Just as our MicroLeadFrame®
platform has enjoyed wide-spread adoption in the industry, we believe
FusionQuad™ represents a similar breakthrough
in performance, size and cost for higher lead count devices. We’ve
had strong acceptance from our alpha customers during the qualification
phase, leading to key design wins in the target applications.” "With the combination of outstanding thermal
capability and excellent RF electrical performance in a cost-effective
package, we believe IC designers, system architects and packaging
experts will find FusionQuad™ a compelling
solution for a wide range of applications including computing,
communications and consumer electronics,”
said Tim Olson, senior vice president of SiP and leadframe products at
Amkor.
"The unique footprint of FusionQuad™
allows for mounting on low cost printed circuit boards enabling
cost-effective system solutions. Board level mounting and reliability
studies have been successfully completed by Amkor, a leading EMS
provider, and the OEM. Our goal is to establish FusionQuad™
as an industry standard with broad availability,”
noted Olson.
FusionQuad™ is a trademark of Amkor
Technology, Inc.
MicroLeadFrame®
is a registered trademark of Amkor Technology, Inc.
About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced
semiconductor assembly and test services. The company offers
semiconductor companies and electronics OEMs a complete set of
microelectronic design and manufacturing services. More information on
Amkor is available from the company’s SEC
filings and technical information on FusionQuad™
can be found on Amkor’s web site: www.amkor.com.
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