Bulova Technologies Group, Inc. (Pink Sheets:BLVT) ("BulovaTech” or "the
Company”) announced today that it has signed a Letter of Commitment with
a private investor who will provide a $3,000,000 loan to the Company
with terms and market rate interest, appropriate for loans of this type.
Funds will be used for general corporate purposes and working capital.
The investor has advanced partial funding of approximately 20% of the
commitment as of this date. The closing date of the entire commitment is
anticipated not later than July 31, 2011.
Stephen L. Gurba, President, Chief Executive Officer, and Chairman of
the Board of Directors stated, "This loan will provide the Company with
the funds necessary to execute our Business Plan and achieve the 5 Year
Forecast we published on May 18th.”
About Bulova Technologies Group, Inc.
Bulova Technologies Group, Inc. and Bulova Technologies (Europe) are
headquartered in Clearwater, Florida. Bulova Technologies Europe is
registered with the United States Department of State Directorate of
Defense Trade Controls (DDTC) as a broker.
Bulova Technologies Ordnance Systems located in Mayo, Florida, is a
load, assembly, and pack (L.A.P.) facility specializing in fuzes, safe
and arming devices and explosive simulators.
Please visit our website at www.BulovaTechGroup.com
for more information.
Statements about the Company's future expectations and all other
statements in this press release other than historical facts, are
"forward-looking statements" within the meaning of Section 27A of the
Securities Act of 1933, Section 21E of the Securities Exchange Act of
1934, and as that term is defined in the Private Securities Litigation
Reform Act of 1995. The Company intends that such forward-looking
statements be subject to the safe harbors created thereby. The above
information contains information relating to the Company that is based
on the beliefs of the Company and/or its management as well as
assumptions made by and information currently available to the Company
or its management.
