Tessera Licenses SHELLCASE MVP Technology to JCAP

Tessera Technologies, Inc. (Nasdaq:TSRA) announced today that China-based Jiangyin Changjiang Advanced Packaging Corporation (JCAP) has licensed Tessera’s SHELLCASE® MVP image sensor packaging technology. JCAP will use the SHELLCASE MVP technology in its production line for image sensor wafer-level packaging designed for portable products such as mobile phones, notebook and netbook computers, as well as camera products in consumer electronics.

"Tessera’s leading-edge SHELLCASE wafer-level packaging technology will help us to be successful in the highly competitive, rapidly evolving global consumer electronics market,” said Lai Chih-Ming, president, JCAP. "Our customers will benefit from this wafer-level chip-scale packaging technology with its stronger electric performance efficiency.”

"As a growing percentage of CMOS image sensors are being manufactured with chip-scale packaging, the cost and form factor benefits of our through silicon via (TSV) wafer-level packaging technology are being recognized by our customers,” said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. "We are very pleased to have JCAP, a leader in wafer-level processing, to help make this capability available to the camera module supply chain.”

Tessera recorded an initial fee from JCAP under this license agreement in the third quarter of 2009. Because SHELLCASE MVP is ‘infrastructure’ intellectual property the timing between signing a SHELLCASE MVP license agreement and Tessera’s receipt of initial royalty payments under the agreement is approximately 15-30 months.

About SHELLCASE

Tessera’s industry-proven SHELLCASE wafer-level chip-scale packaging technology (WLCSP) helps reduce costs and accelerate time-to-market. The packaging solution incorporates a thin layer of glass to cover image sensors at the wafer level. The cover glass improves protection of the image sensors from contamination when the individual sensor die are diced and during subsequent camera module assembly stages. This helps increase manufacturing yields, which are affected by contamination, and enables manufacturers to run lower-cost manufacturing assembly processes by reducing the need for expensive clean room facilities.

A conventional WLCSP is an integrated circuit (IC) package with an area no greater than 1.2 times that of the IC and is mounted on the IC at the wafer level. The SHELLCASE MVP solution provides a WLCSP the same size of the IC. It is one of the industry’s first solutions to use through silicon vias (TSVs), which are vertical electrical connections passing through a silicon wafer or die. TSVs allow 3D die stacking of the image sensor on another IC by vertically integrating two or more die with a dense, high-speed interface.

The SHELLCASE MVP WLP technology is available for licensing from Tessera.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the duration of Tessera’s relationship with Jiangyin Changjiang Advanced Packaging Corporation (JCAP), JCAP’s use of Tessera’s SHELLCASE MVP technology, the functionality, speed and efficiency of Tessera’s SHELLCASE MVP technology, and the impact of the SHELLCASE MVP technology on JCAP’s business. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2008 and its Quarterly Report on Form 10-Q for the quarter ended September 30, 2009, include more information about factors that could affect the company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.

About Tessera

Tessera Technologies, Inc. invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera's imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1-408-321-6000 or go to www.tessera.com.

Tessera, the Tessera logo and SHELLCASE are trademarks or registered trademarks of Tessera, Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.