Amkor Announces FusionQuad(R) Technology Licensed to ASAT
Amkor Technology, Inc. (Nasdaq: AMKR) today announced ASAT Holdings
Limited (Nasdaq: ASTT) has entered into an agreement to license Amkor’s
FusionQuad® package
technology. This agreement will enable ASAT to manufacture packages
based on Amkor’s FusionQuad®
technology platform.
"The market has been seeking a low cost
package technology to better serve applications in the 150 to 350 pin
count range. We believe FusionQuad®
technology meets these cost sensitive requirements and also provides
improved thermal and electrical performance for advanced applications.
We are in the process of deploying this technology to meet challenging
ASIC requirements in hard disk drive, multi-functional printer and HDTV
applications,” said Jim Fusaro, Amkor’s
corporate VP responsible for wirebond products. "Amkor
is pleased that ASAT also sees applications for this technology and we
believe multiple sources of supply will facilitate broader adoption of
this innovative new package platform,” added
Fusaro.
"ASAT and Amkor have enjoyed benefits from
our licensing agreements in recent years and we are pleased to extend
that cooperation to include the FusionQuad®
technology. Growth in QFP packages has been slowing as the technology
has matured, with little innovation over the past few years. We believe
the FusionQuad®
technology will inject new growth in the QFP family and is an attractive
extension to our current package offerings,”
said Jeff Osmun, ASAT’s President.
About FusionQuad®
The FusionQuad®
packaging technology is based on a novel leadframe plastic encapsulated
package that provides superior electrical and thermal performance for
cost sensitive applications. FusionQuad®
technology integrates bottom lands within a standard QFP package outline
to enable doubling of the interconnect density, improved signal
integrity for high speed signals and higher power dissipation.
About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of
semiconductor assembly and test services. The company offers
semiconductor companies and electronics OEMs a complete set of
microelectronic design and manufacturing services. More information on
Amkor is available from the company's SEC filings. Additional technical
information on FusionQuad®
can be found on Amkor's web site: www.amkor.com.
About ASAT
ASAT Holdings Limited is a global provider of semiconductor package
design, assembly and test services. With 20 years of experience, the
Company offers a definitive selection of semiconductor packages and
world-class manufacturing lines. ASAT’s
advanced package portfolio includes standard and high thermal
performance ball grid arrays, leadless plastic chip carriers, thin array
plastic packages, system-in-package and flip chip. ASAT was the first
company to develop moisture sensitive level one capability on standard
leaded products. Today the Company has operations in the United States,
Asia and Europe. For more information, visit www.asat.com.
Forward Looking Statement Disclaimer
This press release contains forward-looking statements within the
meaning of federal securities laws. All statements other than statements
of historical fact are considered forward looking statements including,
without limitation, statements regarding the ability of FusionQuad®
packages to meet the cost sensitive requirements and improve thermal and
electrical performance for advanced applications, adoption of the
FusionQuad®
technology, and the impact of FusionQuad®
technology on growth in the QFP family of packages. Important risk
factors that could affect the outcome of the events set forth in these
statements and that could affect our operating results and financial
condition are discussed in the Company’s
Annual Report on Form 10-K for the year ended December 31, 2007 and in
the Company’s subsequent filings with the
Securities and Exchange Commission made prior to or after the date
hereof. Amkor undertakes no obligation to review or update any forward
looking statements to reflect events or circumstances occurring after
the date of this press release.
