Tessera Developing 3MPix Wafer-Level Optics Technology with EDOF

Tessera Technologies, Inc. (Nasdaq:TSRA) today announced it is developing one of the industry’s first 3 megapixel (MPix) wafer-level optics solutions that integrates extended depth of field (EDOF). The innovative new technology will combine the company’s award-winning OptiML™ wafer-level optics with its OptiML Focus image enhancement solution, enabling smaller, lower-cost, higher-quality camera modules for cell phone handsets, web-cams and other camera-enabled mobile devices.

"We believe that wafer-level camera technology will revolutionize the camera module market, both in enabling a whole range of new applications as well as accelerating growth and features in existing applications,” said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. "By complementing our VGA product and technology offering with our 3MPix development and further enhancing this with our OptiML Focus EDOF capability, we are addressing two of the largest volume portions of the Camera module market and are entering a new era of low cost, miniaturized ‘Smart Modules’.”

Tessera’s OptiML wafer-level optics technology incorporates advanced manufacturing techniques which enable the production of thousands of miniature camera lenses on a single wafer using customized, wafer-level, semiconductor manufacturing equipment. These wafers are then stacked to achieve the required performance for the 3MPix camera design. The lenses use solder reflow compatible materials. This enables a more cost-effective camera module manufacturing process, while allowing defective camera modules to be easily reworked and sent through the soldering process again.

Tessera’s OptiML Focus optical image enhancement solution achieves an in-focus image between 20-30cm and infinity with no moving parts, making it more reliable and cost-effective than mechanical approaches.

Sampling of Tessera’s integrated 3MPix wafer-level optics technology is expected to start in Q4 2009.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the development, manufacture, availability, cost, functionality and performance of Tessera’s 3 megapixel wafer-level optics solution that integrates extended depth of field technology, as well the solution’s ability to accelerate growth and features in existing applications. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2008 and its Quarterly Report on Form 10-Q for the quarter ended March 31, 2009, include more information about factors that could affect the company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.

About Tessera

Tessera Technologies, Inc., invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera’s imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.tessera.com.

Tessera, the Tessera logo and OptiML are trademarks or registered trademarks of Tessera, Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.