KLAC Scales in Advanced Packaging: Is Growth Set to Increase Further?
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KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools support 2.5D and 3D integration, which are critical for improving performance and yield in multi-die architectures.To meet growing complexity, KLAC is expanding its packaging portfolio to address tighter tolerances, process variability and accelerated production ramps. Foundry and memory customers are deepening adoption across high-density nodes, reinforcing momentum in performance-centric packaging flows.The advanced packaging business is included in the Semiconductor Process Control segment, which reported $2.74 billion in revenue for the third quarter of fiscal 2025, up 31% year over year. The figure beat the Zacks Consensus Estimate by 0.76%. Advanced packaging revenues are projected to surpass $850 million in 2025, driven by rising demand from both foundry and memory customers. As AI-centric architectures scale, KLAC’s tools are playing a central role in enabling next-generation packaging. With deep domain expertise and an expanding footprint, the company is well-positioned to capture share as advanced packaging becomes a key growth driver across the semiconductor industry.KLA Faces Competitive PressureKLAC’s inspection and metrology leadership in advanced packaging is facing growing competition from Applied Materials AMAT and ASML Holdings ASML, both of which are scaling their roles in enabling complex integration across logic and memory devices.Applied Materials is advancing its position with deposition, etch, and bonding solutions tailored for high-density packaging. AMAT’s investments in hybrid integration platforms and packaging-specific workflows support rising demand from AI-driven logic and HBM customers. These capabilities give Applied Materials an expanding footprint in advanced back-end processes.ASML Holdings is gaining relevance through its EUV lithography systems, which are increasingly used in advanced patterning steps that support downstream packaging performance. As customers transition to tighter geometries and 3D structures, ASML Holding’s tools play a critical role in enabling pattern fidelity and placement precision, indirectly supporting the adoption of advanced packaging across leading fabs.KLAC’s Share Price Performance, Valuation and EstimatesKLAC’s shares have appreciated 46.2% year to date, while the broader Zacks Computer & Technology sector has increased 5.7% and the Zacks Electronics - Miscellaneous Products industry has jumped 12.9%.KLAC PerformanceImage Source: Zacks Investment ResearchKLAC stock is trading at a premium, with a forward 12-month Price/Sales of 10.11X compared with the industry’s 3.2X. KLAC has a Value Score of C.KLAC ValuationImage Source: Zacks Investment ResearchThe Zacks Consensus Estimate for fourth-quarter fiscal 2025 earnings is pegged at $8.53 per share, up by a penny over the past 30 days, indicating 29.24% year-over-year growth.KLA Corporation Price and Consensus KLA Corporation price-consensus-chart | KLA Corporation QuoteThe consensus mark for KLAC’s 2025 earnings is pegged at $32.46 per share, which is up by a penny over the past 30 days. The figure indicates a 36.73% increase year over year.KLAC currently carries a Zacks Rank #2 (Buy). You can see the complete list of today’s Zacks #1 Rank (Strong Buy) stocks here.5 Stocks Set to DoubleEach was handpicked by a Zacks expert as the #1 favorite stock to gain +100% or more in the coming year. While not all picks can be winners, previous recommendations have soared +112%, +171%, +209% and +232%.Most of the stocks in this report are flying under Wall Street radar, which provides a great opportunity to get in on the ground floor.Today, See These 5 Potential Home Runs >>Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report KLA Corporation (KLAC): Free Stock Analysis Report ASML Holding N.V. (ASML): Free Stock Analysis Report Applied Materials, Inc. (AMAT): Free Stock Analysis ReportThis article originally published on Zacks Investment Research (zacks.com).Zacks Investment ResearchWeiter zum vollständigen Artikel bei Zacks
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Quelle: Zacks
Nachrichten zu Packaging Corp. of America
Analysen zu Packaging Corp. of America
Datum | Rating | Analyst | |
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12.07.2019 | Packaging Neutral | Seaport Global Securities | |
23.10.2018 | Packaging Buy | Seaport Global Securities | |
12.10.2018 | Packaging Market Perform | BMO Capital Markets | |
06.02.2017 | Packaging Equal Weight | Barclays Capital | |
27.01.2017 | Packaging Outperform | BMO Capital Markets |
Datum | Rating | Analyst | |
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23.10.2018 | Packaging Buy | Seaport Global Securities | |
12.10.2018 | Packaging Market Perform | BMO Capital Markets | |
27.01.2017 | Packaging Outperform | BMO Capital Markets | |
11.04.2016 | Packaging Buy | Deutsche Bank AG | |
08.01.2016 | Packaging Overweight | Barclays Capital |
Datum | Rating | Analyst | |
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12.07.2019 | Packaging Neutral | Seaport Global Securities | |
06.02.2017 | Packaging Equal Weight | Barclays Capital | |
26.10.2015 | Packaging Equal Weight | Barclays Capital | |
23.04.2015 | Packaging Equal Weight | Barclays Capital | |
09.12.2014 | Packaging Neutral | D.A. Davidson & Co. |
Datum | Rating | Analyst | |
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17.06.2009 | Packaging Corporation of America underweight | JP Morgan Chase & Co. |
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