SK hynix confirms new packaging fab construction in Cheongju

SK hynix on Tuesday confirmed the construction of its new semiconductor packaging fab, dubbed P&T7, in Cheongju, North Chungcheong Province, as the memory giant accelerates expansion of its production capacity for high-bandwidth memory (HBM) for artificial intelligence (AI) accelerators. On its website, SK hynix said it will invest 19 trillion won ($12.92 billion) to build the P&T7 fab on a 230,000-square-meter site in the city’s industrial complex. Construction is set to begin in April with completion targeted for the end of 2027. The company said it is “a strategic decision that reflected the government’s policy goal of balanced national growth while also taking into account supply chain efficiency and future competitiveness.” According to the company, P&T stands for packaging and testing, and P&T7 will be an advanced packaging facility that turns chips produced at front-end fabs into finished products and conducts final quality inspections. The P&T7 plan has been rumored since June 2025, as the company demolished buildings on the site of LG’s former Cheongju Plant 2 that SKWeiter zum vollständigen Artikel bei Korea Times Weiter zum vollständigen Artikel bei Korea Times