[CES 2026] SK hynix unveils 16-high 48Gb HBM4
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SK hynix will unveil its next-generation artificial intelligence (AI) memory solutions at CES 2026 Tuesday, showcasing its latest high-bandwidth memory (HBM) product, a 16-high 48-gigabyte HBM4, for the first time in the world. The latest memory chip is a successor to the 12‑high 36-gigabyte HBM4 that delivers a data rate of 11.7 gigabits per second. The chip development is on track to meet consumer timelines. Sixteen-high HBM4 is widely viewed as a major technical achievement, as stacking 16 layers dramatically increases manufacturing difficulty compared with 12-high products. That is because 16-high chips require thinner spacing between DRAM dies, tighter control of wafer warpage and much more precise alignment and interconnect bonding. They also require more complex thermal management. At its CES 2026 booth, the company also displayed a graphics processing unit (GPU) module equipped with 12-high 36-gigabyte HBM3E for Nvidia's latest AI server units to demonstrate how the memory operates within a real AI environment. The 36-gigabyte 12-high HBM3E is SK hynix's flagship product curreWeiter zum vollständigen Artikel bei Korea Times
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Quelle: Korea Times
