[CES 2026] Samsung Electro-Mechanics eyes AI boom, weighs advanced chip packaging expansion

LAS VEGAS — Chang Duck-hyun, CEO of Samsung Electro-Mechanics, said Tuesday that demand for flip-chip ball grid array (FC-BGA) substrates and multilayer ceramic capacitors (MLCCs) is expected to rise sharply in line with the rapid advancement of artificial intelligence, adding that the company plans to run its FC-BGA production lines at full capacity in the second half of this year. Speaking to reporters on the sidelines of CES 2026, Chang said Samsung Electro-Mechanics is also cautiously reviewing plans to expand FC-BGA capacity amid surging demand from AI servers and data centers. “As demand for AI servers and data centers is increasing sharply, we are carefully considering expanding FC-BGA capacity,” he said. FC-BGA is a high-density package substrate used to connect highly integrated semiconductor chips to mainboards. Demand for FC-BGA and MLCCs used in AI-related applications is rising rapidly as chip complexity and performance requirements increase. “In addition to AI servers, FC-BGA demand from AI data centers — including networking chips, power semiconductors and graphiWeiter zum vollständigen Artikel bei Korea Times Weiter zum vollständigen Artikel bei Korea Times