NHanced supporting mixed-material heterogeneous hybrid bonding production with copper or nickel bonds
17.12.25 11:48 Uhr
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NHanced Semiconductors Inc of Batavia, IL (the first US-based pure-play advanced packaging foundry) says that it uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Its new Besi bonding system further expands its advanced packaging yield and throughput...Weiter zum vollständigen Artikel bei Semiconductor Today
Quelle: Semiconductor Today